Electronic hardware development and fast prototype delivery.
We support the full process from R&D development, technical consulting, and design review to prototype iterations and PCB fabrication, followed by flexible small-to-medium batch production with SMT/THT assembly and functional testing.
Capabilities
Support before, during, and after manufacturing.
From schematic and PCB risk review to PCBA assembly, test fixtures, firmware programming, first-article verification, and production handover.
Hardware consulting
PCB design verification, component selection advice, embedded hardware discussion, and industrialization planning.
Pre-production analysis
Free DFM and DFT analysis to identify pad, footprint, test point, and mass-production risks early.
PCBA assembly
SMT, THT, selective soldering, BGA X-Ray, various surface finishes, and individual ESD packaging.
Functional testing
ICT, AOI, firmware programming, functional testing, first-article verification, and structured issue feedback.
Delivery Process
A clear PCBA delivery workflow.
Each step is built around engineering files, materials, manufacturing, testing, and a feedback loop that reduces cross-time-zone friction.
Requirement review
Confirm board type, quantity, schedule, test requirements, confidentiality level, and known risks.
DFM / DFT
Review Gerber, BOM, Pick & Place files, test points, and assembly feasibility.
Component sourcing
Use inventory, customer libraries, and sourcing channels to prepare prototyping materials.
PCB + assembly
PCB fabrication, SMT, THT, selective soldering, and necessary rework.
Quality testing
SPI, AOI, ICT, X-Ray, FCT, and first-article functional verification.
Delivery review
Document findings and update the customer component library for faster next iterations.
Quality & Production
Production strategy for prototypes and small-to-medium batches.
For very large-scale orders above 200k PCBAs per order, we recommend a direct manufacturing contract and can assist with the supplier connection.
FR-4, FPC, aluminum, copper core, high-frequency materials, HDI, buried/blind vias, and via-in-pad.
HASL, ENIG, immersion silver, OSP, hard gold plating, and related finishes.
Electrical performance, AOI, ICT, X-Ray, solderability, ionic contamination, thermal stress, and coating thickness.
Firmware programming, component baking, trace/pad tinning, surface cleaning, conformal coating, and ESD packaging.
